AMD graphics card partner XFX has launched a new flagship. We first saw theXFX Radeon RX 7900 XTX Phoenix Nirvanagraphics card at the end of April, but now it has been listed on China’s JD.com retail portal.VideoCardzspotted this product release, which differentiates itself with a brand-new cooler and color scheme.
If Nirvana can be reached by becoming one of thebest graphics cards, then the new XFX looks like it has a good chance to get there. It is even larger than the XFX MERC 310 design, boasting a significantly heavier triple fan heatsink taking the card up to 4-slots in thickness. In addition to the challenging girth, PC DIYers will have to pay attention to the card’s 346mm length and 130mm height.
One of the highlights of the Phoenix Nirvana that XFX wants to make buyers aware of is the so-called ‘Fengling Cooling Architecture 4.0.” This cooling system features the aforementioned triple fans, which are modular and magnetically attached, with six heatpipes, a 216 ultra-matrix fin heatsink, and a cast aluminum vapor chamber base. Moreover, XFX uses a 15,000W/mK Honeywell PTM 7950 phase-changingthermal pad.
The new XFXRadeonRX 7900 XTX Phoenix Nirvana may be a China exclusive. We haven’t seen any PR or social media teasing of this model in the West, but it may just be a matter of time. Priced at ¥7,899 in China, a direct currency conversion indicates a U.S. price of roughly $1,100.
Lastly, in its introduction of the Phoenix Nirvana, the source suggests it may be an XFX design that was prepared for an upcoming high-endRDNA4 graphics cardwhich has since been canceled. We have seen some indications that RDNA4 GPUs are being prepared to focus onlower-tier parts, but it was far from conclusive.
We have reviewed several RX 7900 XTX samples previously. However good the new cooler is, it probably won’t move the needle too far from thereferenceandSapphire RX 7900 XTX Nitro+ Vapor-Xmodels we have previously had in the labs.
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Mark Tyson is a news editor at Tom’s Hardware. He enjoys covering the full breadth of PC tech; from business and semiconductor design to products approaching the edge of reason.
