TSMC details 12.8 Tbps on-package optical communications — an efficient silicon photonics interconnect for AI
Rumors about TSMC having a silicon photonics program have been around for a long time, and at its Northern American Technology Symposium 2024, the company finally outlined its solution. The goal is to improve on-package connectivity, spanning all the way to 12.8 Tbps of bandwidth.“As we bring more computational capability into the mass packaging, data transfers become a challenge, but we find ourselves often limited by the I/O vendors,” said Kevin Zhang, Vice President of Business Development at TSMC....